Chip-scale package (CSP): the MEMS and IC chips are attached via

Download scientific diagram | Chip-scale package (CSP): the MEMS and IC chips are attached via face-to-face flip-chip bonding. (b) Photograph of a 3-axis accelerometer (VTI, CMA 3000) fabricated using chip-on-MEMS technology. Package dimensions: 2 × 2 × 1 mm3. From Ref 61. from publication: Integrating MEMS and ICs | The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs typically provide functionalities | Micro-Electrical-Mechanical Systems, Transducers and Devices | ResearchGate, the professional network for scientists.

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